Superseded
Standard
Historical
IEC 61189-3:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
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Summary
Provides a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for
manufacturing interconnection structures (printed boards) and
assemblies. It mainly covers chemical, mechanical and electrical
test methods.
procedures that can be applied to test materials used for
manufacturing interconnection structures (printed boards) and
assemblies. It mainly covers chemical, mechanical and electrical
test methods.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/10/1997 |
| Release Date | 04/10/1997 |
| Cancellation Date | 10/09/2007 |
| Edition | 1 |
| Page Count | 105 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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