Superseded
Standard amendment
Historical
IEC 61189-3:1997/AMD1:1999
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
Preview
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Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 07/29/1999 |
| Release Date | 07/29/1999 |
| Cancellation Date | 10/09/2007 |
| Edition | 1 |
| Page Count | 65 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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