Superseded
Standard
Historical
IEC 61189-3:1997+AMD1:1999 Consolidated
Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
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Summary
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods. This consolidated version consists of the first edition (1997) and its amendment 1 (1999). Therefore, no need to order amendment in addition to this publication.
Notes
Combine CEI 61189-3 (1997-04) et AMD 1 (2006-08)
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/27/2006 |
| Release Date | 11/27/2006 |
| Cancellation Date | 10/09/2007 |
| Edition | 1.1 |
| Page Count | 141 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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