F01

ASTM F72-17e1

ASTM F72-17e1

Superseded Historical

Standard Specification for Gold Wire for Semiconductor Lead Bonding

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ASTM F1513-99(2003) (R1999)

ASTM F1513-99(2003) (R1999)

Superseded Historical

Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications

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ASTM F2357-04

ASTM F2357-04

Superseded Historical

Standard Test Method for Determining the Abrasion Resistance of Inks and Coatings on Membrane Switches Using the Norman Tool "RCA" Abrader

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ASTM F18-64(2006)

ASTM F18-64(2006)

Superseded Historical

Standard Specification and Test Method for Evaluation of Glass-to-Metal Headers Used in Electron Devices

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ASTM F44-95(2006)

ASTM F44-95(2006)

Superseded Historical

Standard Specification for Metallized Surfaces on Ceramic

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ASTM F487-88(2006)

ASTM F487-88(2006)

Superseded Historical

Standard Specification for Fine Aluminum-1% Silicon Wire for Semiconductor Lead-Bonding

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ASTM F458-06

ASTM F458-06

Superseded Historical

Standard Practice for Nondestructive Pull Testing of Wire Bonds

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ASTM F106-06

ASTM F106-06

Superseded Historical

Standard Specification for Brazing Filler Metals for Electron Devices

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ASTM F459-06

ASTM F459-06

Superseded Historical

Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds

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ASTM F584-06

ASTM F584-06

Superseded Historical

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire

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ASTM F7-95(2006)

ASTM F7-95(2006)

Superseded Historical

Standard Specification for Aluminum Oxide Powder

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ASTM F1269-06

ASTM F1269-06

Superseded Historical

Test Methods for Destructive Shear Testing of Ball Bonds

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ASTM F16-67(2006)

ASTM F16-67(2006)

Superseded Historical

Standard Test Methods for Measuring Diameter or Thickness of Wire and Ribbon for Electronic Devices and Lamps

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ASTM F72-06

ASTM F72-06

Superseded Historical

Standard Specification for Gold Wire for Semiconductor Lead Bonding (Withdrawn 2015)

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ASTM F584-06e1

ASTM F584-06e1

Withdrawn Most Recent

Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire (Withdrawn 2015)

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