Superseded Standard
Historical

IEC 60191-4:1999

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Summary

Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 10/08/1999
Release Date 10/08/1999
Cancellation Date 10/10/2013
Edition 2
Page Count 39
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ISBN ---
Weight (in grams) ---
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