Superseded
Standard
Historical
IEC 60191-4:1999+AMD1:2001+AMD2:2002 Consolidated
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Summary
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages. This consolidated version consists of the second edition (1999), its amendment 1 (2001) and its amendment 2 (2002). Therefore, no need to order amendments in addition to this publication.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 10/22/2002 |
| Release Date | 10/22/2002 |
| Cancellation Date | 10/10/2013 |
| Edition | 2.2 |
| Page Count | 43 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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