Superseded Standard
Historical

IEC 60191-4:1999+AMD1:2001+AMD2:2002 Consolidated

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Summary

Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages. This consolidated version consists of the second edition (1999), its amendment 1 (2001) and its amendment 2 (2002). Therefore, no need to order amendments in addition to this publication.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 10/22/2002
Release Date 10/22/2002
Cancellation Date 10/10/2013
Edition 2.2
Page Count 43
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ISBN ---
Weight (in grams) ---
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