Superseded
Standard
Historical
IEC 60191-4:1987
Mechanical standardization of semiconductor devices. Part 4: Coding systems and classification into forms of package outlines for semiconductor devices
Preview
Summary
Gives recommended practice for the designation of package outlines and for the classification into forms of package outlines for semiconductor devices.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/30/1987 |
| Release Date | 03/30/1987 |
| Cancellation Date | 10/08/1999 |
| Edition | 1 |
| Page Count | 9 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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