Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General examination; Section 3: Test 1c: Electrical engagement length (IEC 60512-1-3:1997); German version EN 60512-1-3:1997
€34.30
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General; Section 4: Test 1d: Contact protection effectiveness (scoop-proof) (IEC 60512-1-4:1997); German version EN 60512-1-4:1997
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 19: Chemical resistance tests; section 3: Test 19c: Fluid resistance (IEC 60512-19-3:1997); German version EN 60512-19-3:1997
€41.78
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996); German version EN 60512-12-6:1996
Transformers and inductors for use in telecommunication and electronic equipment - Main dimensions of coil formers - Part 1: Coil formers for laminated cores (IEC 61797-1:1996); German version EN 61797-1:1996
€91.03
Electromechanical components for electronic equipment; basic testing procedures and measuring methods; part 5: impact tests (free components), static load tests (fixed components), endurance tests and overload tests; identical with IEC 60512-5:1992.
€63.27
Electromechanical components for electronic equipment; basic testing procedures and measuring methods; part 9: miscellaneous tests; identical with IEC 60512-9:1992.
€56.17
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
€116.64
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (IEC 62047-1:2016); German version EN 62047-1:2016.
€128.22
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (IEC 62047-25:2016); German version EN 62047-25:2016
€105.42
Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature (IEC 47F/243/CD:2016)
€69.91
Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film (IEC 47F/241/CD:2016)
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General - Section 4: Test 1d: Contact protection effectiveness (scoop-proof) (IEC 60512-1-4:1997); German version EN 60512-1-4:1997, Corrigendum to DIN EN 60512-1-4:1998-02; (IEC-Cor. :2000 to IEC 60512-1-4:1997)
€0.00
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
€98.32
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012); German version EN 62047-13:2012
