Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (IEC 47F/127/CD:2012)
€77.20
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding quality between PDMS and glass (IEC 47F/126/CD:2012)
€69.91
Technical documentation for the assessment of electrical and electronic products with respect to the restriction of hazardous substances
€63.27
Connectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors
€600.00
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 47F/88/CD:2011)
€116.64
Amendment 1 - Connectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors
€22.00
Connectors for electronic equipment. Tests and measurements Static load tests (fixed connectors). Test 8c. Robustness of actuating lever
€165.00
Semiconductor devices - Micro- electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin film (IEC 47F/78/CD:2011)
€111.40
Semiconductor devices - Micro-electromechanical devices - Part 18: Bending test methods of thin film materials (IEC 47F/76/CD:2011)
Connectors for electronic equipment - Tests and measurements - Part 8-3: Static load tests (fixed connectors) - Test 8c: Robustness of actuating lever
Connectors for electronic equipment. Tests and measurements Screening filtering tests. Test 23b. Suppression characteristics of integral filters
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 47F/59/CD:2010)
€98.32
Connectors for electronic equipment. Tests and measurements Endurance tests. Test 9e. Current loading, cyclic
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (IEC 47F/49/CD:2010)
€91.03
Semiconductor devices - Micro-electromechanical devices - Part 12: A method for fatigue testing thin film materials using the resonant vibration of a MEMS structure (IEC 47F/43/CD:2010)
