Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC Stripline method (IEC 47A/811/CD:2009)
€105.42
Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC Stripline method (IEC 47A/810/CD:2009)
Semiconductor devices - Part 16-3: Microwave integrated circuits; Frequency converters (IEC 60747-16-3:2002); German version EN 60747-16-3:2002.
€122.34
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions; Magnetic probe method (IEC 61967-6:2002); German version EN 61967-6:2002.
Semiconductor die products - Part 1: Requirements for procurement and use (IEC 62258-1:2005); German version EN 62258-1:2005.
Semiconductor die products - Part 2: Exchange data formats (IEC 47/1651/CD:2002)
€179.53
Semiconductor die products - Part 1: Requirements for procurement and use (IEC 47/1650/CD:2002)
Microstructures - Certification de ligne de fabrication pour MCM (Multi Chip Modules) (QML)
€213.00
IEC 62215-3:2013 Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
€302.00
IEC TS 62132-9:2014 Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method
€244.00
IEC TS 61967-3:2014 Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method
Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 8 : mesure de l'immunité rayonnée - Méthode de la ligne TEM à plaques pour circuit intégré
€111.67
Standard Specification for Pure Aluminum (Unalloyed) Source Material for Electronic Thin Film Applications
This product is not for sale, please contact us for more information
Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]
Standard Test Method for Estimating Electromigration Median Time-To-Failure and Sigma of Integrated Circuit Metallizations [Metric]