IEC 63011-2:2018 Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect
€93.00
IEC 62228-3:2019 Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers
€441.00
IEC 62228-7:2022 Integrated circuits - EMC evaluation of transceivers - Part 7: CXPI transceivers
€389.00
IEEE Standard for Terminology and Test Methods of Digital-to-Analog Converter Devices
€115.00
IEEE Standard Testability Method for Embedded Core-based Integrated Circuits
€160.00
Reliability details to be given in data sheets; mode of representation
€24.39
Electrical measuring methods for integrated circuits; output pulse duration t
Semiconductor devices and integrated circuits; kinds of devices and general terms
€84.58
Integrated film circuits; material, methods for judgement of thick film resistor compositions
Electrical measuring methods for integrated circuits; recovery time t
SPECIFICATION FOR COATINGS FOR LOADED PRINTED WIRE BOARDS (CONFORMAL COATINGS). PART 1: DEFINITIONS, CLASSIFICATION AND GENERAL REQUIREMENTS.
€47.00
SPECIFICATION FOR COATINGS FOR LOADED PRINTED WIRE BOARDS (CONFORMAL COATINGS). PART 2: METHODS OF TEST.
€69.00
COATINGS FOR LOADED PRINTED WIRE BOARDS (CONFORMAL COATINGS). PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS. SHEET 1: COATINGS FOR GENERAL PURPOSE (CLASS I) AND FOR HIGH RELIABILITY (CLASS II).
€40.00
Semiconductor devices; generic specification for semiconductor devices and integrated circuits; identical with IEC 60747-10, edition 1984
Semiconductor devices - Part 16-4 : microwave integrated circuits - Switches
€59.33
