Standard Test Method for Thickness of Lightly Doped Silicon Epitaxial Layers on Heavily Doped Silicon Substrates Using an Infrared Dispersive Spectrophotometer (Withdrawn 2003)
This product is not for sale, please contact us for more information
Standard Specification for Electronic Grade Alloys of Copper and Nickel in Wrought Forms
Standard Practices for Determining Hermeticity of Electron Devices by Dye Penetration
Standard Specification for Brazing Filler Metals for Electron Devices
Standard Test Method for Thickness of Epitaxial or Diffused Layers in Silicon by the Angle Lapping and Staining Technique (Withdrawn 2003)
Standard Practice for Determining Barium Yield, Getter Gas Content, and Getter Sorption Capacity for Barium Flash Getters (Withdrawn 2008)
Standard Guide for Identification of Structures and Contaminants Seen on Specular Silicon Surfaces (Withdrawn 2003)
Standard Test Method for Density of Fine Wire and Ribbon Wire for Electronic Devices
Standard Test Method for Surface Flaws in Tungsten Seal Rod and Wire
Standard Test Method for Measuring Diameter of Fine Wire by Weighing
Standard Test Methods of Testing Fine Round and Flat Wire for Electron Devices and Lamps
Standard Specification for Chromium-Iron Sealing Alloys with 18 or 26 Percent Chromium
Standard Test Method for Sag of Tungsten Wire
Standard Specification for Tungsten Wire for Electron Devices and Lamps
Standard Specification for Molybdenum Wire and Rod for Electronic Applications