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IEC 61163-1:2006

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots

Summary

This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 06/26/2006
Release Date 06/26/2006
Edition 2
Page Count 161
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