Superseded
Standard
Historical
IEC 60749-15:2010
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Preview
Summary
IEC 60749-15:2010 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron. This second edition cancels and replaces the first edition published in 2003 and constitutes a technical revision. The significant changes with respect from the previous edition include:
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.
- editorial change in the scope;
- addition of lead-free solder chemical composition specification.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 10/28/2010 |
| Release Date | 10/28/2010 |
| Cancellation Date | 07/14/2020 |
| Edition | 2 |
| Page Count | 14 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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