Superseded
Standard
Historical
IEC 60749-15:2003
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Preview
Summary
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 02/07/2003 |
| Release Date | 02/07/2003 |
| Cancellation Date | 10/28/2010 |
| Edition | 1 |
| Page Count | 11 |
| Themes | Environment |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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