Superseded
Standard
Historical
IEC 60068-2-69:1995
Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
Preview
Summary
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices.
The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 12/08/1995 |
| Release Date | 12/08/1995 |
| Cancellation Date | 05/09/2007 |
| Edition | 1 |
| Page Count | 43 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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