31.020 : Electronic components in general

BS EN 60286-4:2013

BS EN 60286-4:2013

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Packaging of components for automatic handling Stick magazines electronic encapsulated in packages different forms

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BS IEC 62396-3:2013

BS IEC 62396-3:2013

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Process management for avionics. Atmospheric radiation effects System design optimization to accommodate the single event (SEE) of atmospheric

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BS IEC 62396-4:2013

BS IEC 62396-4:2013

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Process management for avionics. Atmospheric radiation effects Design of high voltage aircraft electronics managing potential single event

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PD IEC/TS 62647-22:2013

PD IEC/TS 62647-22:2013

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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines

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PD IEC/TS 62647-23:2013

PD IEC/TS 62647-23:2013

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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework repair guidance to address the implications of electronics mixed assemblies

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ANSI/VITA 51.1:2013 (S2025)

ANSI/VITA 51.1:2013 (S2025)

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Reliability Prediction MIL-HDBK-217 Subsidiary Specification

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IEC TS 62647-23:2013

IEC TS 62647-23:2013

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IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies

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BS EN 62321-1:2013

BS EN 62321-1:2013

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Determination of certain substances in electrotechnical products Introduction and overview

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IEC 62396-3:2013

IEC 62396-3:2013

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IEC 62396-3:2013 Process management for avionics - Atmospheric radiation effects - Part 3: System design optimization to accommodate the single event effects (SEE) of atmospheric radiation

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IEC 62396-4:2013

IEC 62396-4:2013

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IEC 62396-4:2013 Process management for avionics - Atmospheric radiation effects - Part 4: Design of high voltage aircraft electronics managing potential single event effects

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IEC TS 62647-22:2013

IEC TS 62647-22:2013

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IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines

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DIN IEC/TS 62647-2*DIN SPEC 42647-2:2013-09

DIN IEC/TS 62647-2*DIN SPEC 42647-2:2013-09

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Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)

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PD IEC/TS 62647-21:2013

PD IEC/TS 62647-21:2013

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Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Program management. Systems engineering guidelines managing the transition to electronics

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IEC 60286-4:2013

IEC 60286-4:2013

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Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms

€88.00

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IEC TS 62647-21:2013

IEC TS 62647-21:2013

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IEC TS 62647-21:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics

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