Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015.
€140.00
Electronics assembly technology - Part 4 : endurance test methods for solder joint of area array type package surface mount devices
€138.00
Optics and photonics — Holography Part 1: Methods of measuring diffraction efficiency and associated optical characteristics of holograms
€115.00
Optics and photonics — Holography Part 2: Methods for measurement of hologram recording characteristics
€155.00
Standard Test Method for Application of Ionization Chambers to Assess the Low Energy Gamma Component of Cobalt-60 Irradiators Used in Radiation-Hardness Testing of Silicon Electronic Devices
€65.00
Detail specification : Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2
Enregistrement d'ontologie de produits normalisés et transfert par tableurs - Partie 1 : structure logique pour les paquets de données
€315.33
Configuration Management Requirements For Defense Contracts
€67.00
Reducing the Risk of Tin Whisker-Induced Failures in Electronic Equipment (Stabilized: Oct 2014)
€124.00
The Next Generation of Systems Engineering: A Report by the GEIA G-47 Systems Engineering Panel (Stabilized: Oct 2014)
€232.00
Acceleration Factors
€70.00
Process management for avionics. Atmospheric radiation effects Assessment of thermal neutron fluxes and single event in avionics systems
€269.00
IEC 62396-5:2014 Process management for avionics - Atmospheric radiation effects - Part 5: Assessment of thermal neutron fluxes and single event effects in avionics systems
€176.00
Guidance on quantifying greenhouse gas emission reductions from the baseline for electrical and electronic products and systems
€374.00
Detail specification : fixed low power film SMD resistors - Rectangular - Stability classes 0,1;0,25;0,5;1 - Spécification particulière : Résistances couche fixes à faible dissipation CMS
€59.33
