31.020 : Electronic components in general

NF EN 60191-6-18, C96-013-6-18 (08/2010)

NF EN 60191-6-18, C96-013-6-18 (08/2010)

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Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-18 : règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface - Guide de conception pour les boîtiers matriciels à billes (BGA)

€106.33

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NF EN 62137-1-5, C93-704-1-5 (08/2009)

NF EN 62137-1-5, C93-704-1-5 (08/2009)

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Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-5 : mechanical shear fatigue test - Technologie du montage en surface

€111.67

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NF EN 61760-3, C90-710-3 (07/2010)

NF EN 61760-3, C90-710-3 (07/2010)

Withdrawn Most Recent

Surface mounting technology - Part 3 : standard method for the specification of components for Through Hole Reflow (THR) soldering

€120.00

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NF EN 62474, C05-474 (11/2012)

NF EN 62474, C05-474 (11/2012)

Superseded Historical

Material declaration for products of and for the electrotechnical industry

€179.67

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NF EN 60539-2/A1, C93-272-2/A1 (05/2011)

NF EN 60539-2/A1, C93-272-2/A1 (05/2011)

Superseded Historical

Directly heated negative temperature coefficient thermistors - Part 2 : sectional specification - Surface mount negative temperature coefficient thermistors

€56.33

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NF EN 61837-1, C93-628-1 (02/2013)

NF EN 61837-1, C93-628-1 (02/2013)

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Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1 : plastic moulded enclosure outlines - Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence

€87.39

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UTE C80-811, C80-811U (01/2011)

UTE C80-811, C80-811U (01/2011)

Superseded Historical

Reliability Methodology for Electronic Systems - FIDES Guide 2009 issue A - Méthodologie de fiabilité pour les systèmes électroniques

€405.00

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NF EN 61709, C20-343 (07/2017)

NF EN 61709, C20-343 (07/2017)

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Electric components - Reliability - Reference conditions for failure rates and stress models for conversion

€218.89

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NF EN 140401-802, C83-241-802 (04/2008)

NF EN 140401-802, C83-241-802 (04/2008)

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Detail specification : fixed low power film SMD resistors - Rectangular - Stability classes 1, 2 - Spécification particulière : résistances couche fixes à faible dissipation CMS

€126.00

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NF EN 140401-803, C83-241-803 (04/2008)

NF EN 140401-803, C83-241-803 (04/2008)

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Detail specification : fixed low power film SMD resistors - Cylindrical - Stability classes 0,05, 0,1, 0,25, 0,5, 1, 2 - Spécification particulière : résistances couche fixes à faible dissipation CMS)

€138.00

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NF EN 60938-2-1, C93-380-2-1 (06/2014)

NF EN 60938-2-1, C93-380-2-1 (06/2014)

Superseded Historical

Fixed inductors for electromagnetic interference suppression - Part 2-1 : blank detail specification - Inductors for which safety tests are required - Assessment level D

€85.00

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NF EN 60938-2-2, C93-380-2-2 (10/2016)

NF EN 60938-2-2, C93-380-2-2 (10/2016)

Withdrawn Most Recent

Fixed inductors for electromagnetic interference suppression - Part 2-2 : blank detail specification - Inductors for which safety tests are required (only)

€76.00

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NF EN 50625-2-1, C05-625-2-1 (08/2015)

NF EN 50625-2-1, C05-625-2-1 (08/2015)

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Collection, logistics and treatment requirements for WEEE - Part 2-1 : treatment requirements for lamps

€111.67

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NF EN 50625-2-2, C05-625-2-2 (09/2015)

NF EN 50625-2-2, C05-625-2-2 (09/2015)

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Collection, logistics and treatment requirements for WEEE - Part 2-2 : treatment requirements for WEEE containing CRTs and flat panel displays

€95.67

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NF EN 60191-6-1, C96-013-6-1 (08/2002)

NF EN 60191-6-1, C96-013-6-1 (08/2002)

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Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lead terminals

€53.67

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