WL 5.4110:1998-10
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WL 5.4110:1998-10

Aerospace series - Structural adhesive films on a modified EP basis - Standard curing temperature 125 °C, applicable from - 55 °C to 80 °C

Summary

Luft- und Raumfahrt - Strukturelle Klebfolien, Basis modifiziertes EP-System - Standardhärtungstemperatur 125 °C, einsetzbar von - 55 °C bis 80 °C

Technical characteristics

Publisher Deutsche Institut für Normung e.V. (DIN)
Publication Date 10/01/1998
Page Count 7
EAN ---
ISBN ---
Weight (in grams) ---
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