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SAE ARP 6415:2019-07-23
Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
Summary
This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.
Technical characteristics
| Publisher | SAE International |
| Publication Date | 07/23/2019 |
| Page Count | 32 |
| Themes | Aerospace |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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23/07/2019
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