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SAE ARP 6415:2019-07-23

Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder

Summary

This document contains information and guidance on the use of Pb-free ball grid arrays (BGAs) in an aerospace, defense, and high performance (ADHP) product, or other products which demand a high reliability.

Technical characteristics

Publisher SAE International
Publication Date 07/23/2019
Page Count 32
Themes Aerospace
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