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SAE ARP 1612A:2022-06-05
Polyimide Printed Circuit Boards Fabrication of
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Summary
This document describes the materials, equipment, and processing techniques utilized in the fabrication of polyimide printed wiring boards. Included are recommendations for both double-sided and multilayer boards.
Notes
Approuvée 2014-08-14.
Technical characteristics
| Publisher | SAE International |
| Publication Date | 06/05/2022 |
| Confirmation Date | 06/05/2022 |
| Page Count | 18 |
| Themes | Aerospace |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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05/06/2022
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