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IPC-TR-586 - Standard Only:2009

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

Summary

This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by Rockwell Collins and c) Solder joint silver content calculations by Adtran Inc.

Technical characteristics

Publisher IPC standards by Global Electronics Association
Publication Date 03/01/2009
Edition 0
Page Count 61
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