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IPC-TR-586 - Standard Only:2009
IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
Summary
This technical report provides the documentation of a round robin testing effort that generated data used by the 4-14 Plating Processes Subcommittee in developing the maximum immersion silver plating thickness requirement in the revision A of IPC-4553. This compendium of data resulted from three information sets: a) Test vehicle assembly report by Celestica, b) Thermal cycle test report by Rockwell Collins and c) Solder joint silver content calculations by Adtran Inc.
Technical characteristics
| Publisher | IPC standards by Global Electronics Association |
| Publication Date | 03/01/2009 |
| Edition | 0 |
| Page Count | 61 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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