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IPC-4563 - Standard Only:2008
IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline
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Summary
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies. 19 pages. Released November 2007.
Technical characteristics
| Publisher | IPC standards by Global Electronics Association |
| Publication Date | 02/11/2008 |
| Edition | 0 |
| Page Count | 19 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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11/02/2008
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