Summary
The IPC-2231 standard provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.
Technical characteristics
| Publisher | IPC standards by Global Electronics Association |
| Publication Date | 04/01/2019 |
| Edition | 0 |
| Page Count | 56 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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