IEEE P3537

New IEEE Standard - Active - Draft.
This standard defines a modular hierarchical language syntax, rules, and usage model to represent a high-level description of the components and connectivity between various components (including chiplets, interposers, substrates, etc.) in 2.5D/3D advanced packaging technologies. This description language enhances the 3Dblox description language. For each component, a high-level description includes size, orientation, interface, thickness, interconnect regions, interconnect structures, and other physical properties required for integration in a 2.5D/3D stack. The features of this description language are designed to serve chiplet makers, 2.5D/3D packagers, and end users.

This standard aims to not only enable interoperability between different Electronic Design Automation (EDA) tools but also reduce design iterations and streamline the manufacturing process.