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IEC TR 62866:2014
Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
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Summary
IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 05/07/2014 |
| Release Date | 05/07/2014 |
| Edition | 1 |
| Page Count | 187 |
| Themes | Quality assurance |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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07/05/2014
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