Superseded
Standard
Historical
IEC TR 60068-3-12:2007
Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
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Summary
Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/12/2007 |
| Release Date | 03/12/2007 |
| Cancellation Date | 10/17/2014 |
| Edition | 1 |
| Page Count | 16 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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