Superseded
Standard
Historical
IEC PAS 62307:2002
Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits
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Summary
Details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of IC components. These two material properties are important parameters for the effective reliability performance of plastic packaged ICs after exposure to moisture and subjected to high temperature solder reflow.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/12/2002 |
| Release Date | 03/12/2002 |
| Cancellation Date | 07/24/2006 |
| Edition | 1 |
| Page Count | 9 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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