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IEC PAS 62293:2001
Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
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Summary
Establishes the specific requirements for organic high-density interconnect layers with microvia technology as well as the quality and reliability assurance requirements that shall be met for their acquisition.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/28/2001 |
| Release Date | 11/28/2001 |
| Cancellation Date | 10/29/2004 |
| Edition | 1 |
| Page Count | 60 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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28/11/2001
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