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IEC PAS 62204:2000
Standard method for measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line
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Summary
Aims at determining the temperature coefficient of resistance (at a given reference temperature) of aluminium and aluminium-alloy thin-film metallization that are used in microelectronic circuits and devices.
This method is intended for estimating a mean temperature of a metallization line stressed in an accelerated electromigration stress test before any irreversible change in resistivity occurs due to the current-density and temperature stresses imposed.
This method is intended for estimating a mean temperature of a metallization line stressed in an accelerated electromigration stress test before any irreversible change in resistivity occurs due to the current-density and temperature stresses imposed.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/28/2000 |
| Release Date | 11/28/2000 |
| Cancellation Date | 05/17/2004 |
| Edition | 1 |
| Page Count | 25 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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