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IEC PAS 62203:2000
Guide for the standard probe pad sizes and layouts for wafer-level electrical testing
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Summary
Applies to double- and single-column arrays of metal probe pads, on a semiconductor wafer or chip, that are electrically connected to one or more test structures.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/28/2000 |
| Release Date | 11/28/2000 |
| Cancellation Date | 05/17/2004 |
| Edition | 1 |
| Page Count | 6 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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28/11/2000
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