Superseded Standard
Historical

IEC PAS 62191:2000

Acoustic microscopy for nonhermetic encapsulated electronic components

Summary

Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.

Technical characteristics

Publisher International Electrotechnical Commission (IEC)
Publication Date 11/28/2000
Release Date 11/28/2000
Cancellation Date 10/17/2001
Edition 1
Page Count 16
EAN ---
ISBN ---
Weight (in grams) ---
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