Summary
This test is performed to determine the effects of bias conditions and temperature on solid state devices over an extended period of time. It is intended primarily for device qualification and reliability monitoring.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/28/2000 |
| Release Date | 11/28/2000 |
| Cancellation Date | 02/23/2004 |
| Edition | 1 |
| Page Count | 6 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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