Superseded
Standard
Historical
IEC PAS 62184:2000
Lead integrity test method
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Summary
Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/22/2000 |
| Release Date | 08/22/2000 |
| Cancellation Date | 08/07/2003 |
| Edition | 1 |
| Page Count | 16 |
| Themes | Quality assurance |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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