Summary
Verifies that the markings on solid state semiconductor devices will not become illegible when subjected to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/24/2000 |
| Release Date | 08/24/2000 |
| Cancellation Date | 04/12/2002 |
| Edition | 1 |
| Page Count | 5 |
| Themes | Quality assurance |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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