Superseded
Standard
Historical
IEC PAS 62174:2000
Resistance to soldering temperature for through-hole mounted devices
Preview
Summary
Determines whether solid state devices can withstand the effects of the temperature to which they will be subjected during soldering of their leads. The heat is conducted through the leads into the device package from solder heat at the reverse side of the board.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/22/2000 |
| Release Date | 08/22/2000 |
| Cancellation Date | 02/07/2003 |
| Edition | 1 |
| Page Count | 5 |
| Themes | Quality assurance |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
22/08/2000
Superseded
Historical
No products.