Superseded
Standard
Historical
IEC PAS 62173:2000
Solderability test method
Preview
Summary
Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.
Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.
Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/22/2000 |
| Release Date | 08/22/2000 |
| Cancellation Date | 03/15/2004 |
| Edition | 1 |
| Page Count | 17 |
| Themes | Quality assurance |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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