Withdrawn
Standard
Most Recent
IEC PAS 62170:2000
Bond wire modeling standard
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Summary
Standardizes the first order modeling of bond wires and the way bond wires are modeled in three dimensional electromagnetic field solvers.
Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.
Describes the modeling of a bond wire from an integrated circuit die to a package lead in a ball or wedge type wire bond configuration.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/24/2000 |
| Release Date | 08/24/2000 |
| Cancellation Date | 05/17/2004 |
| Edition | 1 |
| Page Count | 12 |
| Themes | Quality assurance |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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