Summary
Aims at evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. Employs conditions of temperature, humidity, and bias which accelerate the penetration of moisture through the external protective material or along the interface between the external protective material and the metallic conductors which pass through it.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/22/2000 |
| Release Date | 08/22/2000 |
| Cancellation Date | 01/17/2003 |
| Edition | 1 |
| Page Count | 6 |
| Themes | Quality assurance |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Previous versions
22/08/2000
Superseded
Historical
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