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Standard
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IEC PAS 62085:1998
Implementation of ball grid array and other high density technology
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Summary
Establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 12/03/1998 |
| Release Date | 12/03/1998 |
| Cancellation Date | 10/29/2004 |
| Edition | 1 |
| Page Count | 88 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Previous versions
03/12/1998
Withdrawn
Most Recent
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