Withdrawn
Standard
Most Recent
IEC PAS 61249-3-1:2007
Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
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Summary
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 05/30/2007 |
| Release Date | 05/30/2007 |
| Cancellation Date | 01/09/2015 |
| Edition | 1 |
| Page Count | 31 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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