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IEC 62769-4:2021
Field Device Integration (FDI) - Part 4: FDI Packages
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Summary
IEC 62769-4:2021 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 02/05/2021 |
| Release Date | 02/05/2021 |
| Cancellation Date | 04/05/2023 |
| Edition | 2 |
| Page Count | 165 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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12/05/2015
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05/02/2021
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05/04/2023
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