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IEC 62137-1-1:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
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Summary
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 07/11/2007 |
| Release Date | 07/11/2007 |
| Edition | 1 |
| Page Count | 30 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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