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IEC 61192-4:2002
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
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Summary
Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 11/29/2002 |
| Release Date | 11/29/2002 |
| Cancellation Date | 11/30/2018 |
| Edition | 1 |
| Page Count | 59 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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29/11/2002
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