Withdrawn
Standard
Most Recent
IEC 61192-3:2002
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Preview
Summary
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 12/17/2002 |
| Release Date | 12/17/2002 |
| Cancellation Date | 11/30/2018 |
| Edition | 1 |
| Page Count | 93 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
No products.
Previous versions
17/12/2002
Withdrawn
Most Recent
No products.