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Standard
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IEC 61192-2:2003
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
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Summary
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 03/14/2003 |
| Release Date | 03/14/2003 |
| Cancellation Date | 11/30/2018 |
| Edition | 1 |
| Page Count | 127 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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14/03/2003
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