Superseded
Standard
Historical
IEC 61191-3:1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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Summary
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 08/28/1998 |
| Release Date | 08/28/1998 |
| Cancellation Date | 05/30/2017 |
| Edition | 1 |
| Page Count | 31 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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