Superseded
Standard
Historical
IEC 61188-5-1:2002
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Preview
Summary
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 07/12/2002 |
| Release Date | 07/12/2002 |
| Cancellation Date | 02/23/2021 |
| Edition | 1 |
| Page Count | 141 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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