Superseded
Standard
Historical
IEC 60749-9:2002
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Preview
Summary
Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process.
This test is applicable for all package types. The test should be considered non-destructive.
The contents of the corrigendum of August 2003 have been included in this copy.
This test is applicable for all package types. The test should be considered non-destructive.
The contents of the corrigendum of August 2003 have been included in this copy.
Technical characteristics
| Publisher | International Electrotechnical Commission (IEC) |
| Publication Date | 04/12/2002 |
| Release Date | 04/12/2002 |
| Cancellation Date | 03/03/2017 |
| Edition | 1 |
| Page Count | 9 |
| EAN | --- |
| ISBN | --- |
| Weight (in grams) | --- |
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Previous versions
12/04/2002
Superseded
Historical
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